Method of forming a stack of packaged memory die and resulting apparatus

ABSTRACT

A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a PCB board. One or more multi-conductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devices and external circuitry. One embodiment of the multi-conductor insulating assembly includes tape (such as Kapton™ tape) on which conductors are applied. One surface of the tape is preferably adhesive so as to stick to the integrated circuit devices. When properly aligned, the conductors make contact with the terminals of the integrated circuit devices and with a multi-conductor port. There may be multiple layers of conductors where different terminals aligned in a stack are to receive different signals. Another embodiment of the multi-conductor insulating assembly includes an epoxy onto which conductors are applied. In yet another embodiment, multi-conductor insulating assembly tape is sandwiched between integrated circuit semiconductor devices. Contact pads on the tape are aligned with bond pads on the integrated circuit semiconductor devices.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to packaged integrated circuit devices. Morespecifically, the present invention relates to an interconnected stackof packaged memory devices and the method of forming a stack ofinterconnected packaged memory devices.

2. State of the Art

High performance, low cost, increased miniaturization of components, andgreater packaging density of integrated circuit semiconductor devices(IC's) have long been the goals of the computer industry. Greaterintegrated circuit semiconductor device package density, for a givenlevel of component and internal conductor density, is primarily limitedby the space available for die mounting and packaging. For lead framemounted dies, this limitation is, to a great extent, a result of leadframe design.

In a conventional lead frame design, the lead frame includes a pluralityof leads having their ends terminating adjacent a side or edge of anintegrated circuit semiconductor device supported by the die paddleportion of the lead frame. Electrical connections are made by means ofwire bonds extending between the leads of the lead frame and the bondpads located on the active surface of the integrated circuitsemiconductor device. Subsequent to the wire bonding operation, portionsof the leads of the lead frame and the integrated circuit semiconductordevice are encapsulated in suitable plastic material to form a packagedsemiconductor device. The leads and lead frame are then trimmed andformed to the desired configuration after the packaging of thesemiconductor device in the encapsulant material.

In a Leads-Over-Chip (LOC) type lead frame configuration for anintegrated circuit semiconductor (IC) device, the leads of the leadframe extend over the active surface of the semiconductor device beinginsulated therefrom by tape which is adhesively bonded to thesemiconductor device and the leads of the lead frame. Electricalconnections are made between the leads of the lead frame and bond padson the active surface of the semiconductor device by way of wire bondsextending therebetween. After wire bonding, the leads of the LOC leadframe and the semiconductor device are encapsulated in suitable plasticto encapsulate the semiconductor device and portions of the leads.Subsequently, the leads are trimmed and formed to the desiredconfiguration to complete the packaged semiconductor device.

With ever-increasing demands for miniaturization and higher operatingspeeds, multi-chip module systems (MCMs) have become increasinglyattractive in a variety of applications. Generally, MCMs may be designedto include more than one type of semiconductor device within a singlepackage, or may include multiples of the same type of semiconductordevice, such as the single-in-line memory module (SIMM) or dual-in-linememory module (DIMM).

MCMs typically comprise a planar printed circuit board (PCB) or othersemiconductor carrier substrate to which a plurality of semiconductordevices is attached. Laminated substrates, such as FR-4 boards, areincluded in the term PCB as used herein, as are ceramic and siliconsubstrates, although the latter constructions are at this time lesscommon as MCM carrier substrates. The semiconductor devices aretypically wire bonded, TAB-connected or flip-chip bonded (by an array ofsolder or other conductive bumps or conductive epoxies) to the PCB. AnMCM configuration typically allows semiconductor devices to be bonded toone side only of the carrier substrate. Moreover, for semiconductordevices that are wire bonded to the PCB, the bond wires extend from thetop surface of each semiconductor device mounted on one side of the PCBby its back side to the plane of the PCB surface on that side, requiringlonger wires to be used to connect the semiconductor devices to the PCBtraces than if the active surface of the semiconductor device werecloser to the PCB surface. This often leads to undesirable parasiticelectrical characteristics. Also, mounting the semiconductor devices ona substrate to be subsequently mounted on the PCB uses valuable area ofthe PCB which may be used for other purposes. Additionally, theplurality of wires used to connect the semiconductor devices to thesubstrate of the MCM affects the speed at which the MCM responds whenconnected to the PCB.

In many instances, PCBs (such as those used in computers) have fixedsize requirements, thereby making space on the PCB scarce. Therefore, aneed exists for a high density, minimal volume configuration, and highresponse rate series of interconnected semiconductor devices for use inconjunction with a PCB.

SUMMARY OF THE INVENTION

An integrated circuit semiconductor device stack includes a stack ofpackaged integrated circuit semiconductor devices (IC's) supported by aboard or other support surface. One or more multi-conductor insulatingassemblies provide an interface between terminals of the IC's andexternal circuitry. One embodiment of the multi-conductor insulatingassembly includes tape (such as Kapton™ tape) on which conductors areapplied. One surface of the tape is preferably adhesive so as to stickto the IC's. When properly aligned, the conductors make contact with theterminals of the IC's and with a multi-conductor port. There may bemultiple layers of conductors where different terminals of individualIC's aligned in a stack are to receive different signals. Anotherembodiment of the multi-conductor insulating assembly includes an epoxyonto which conductors are applied. In yet another embodiment,multi-conductor insulating assembly tape is sandwiched between IC's.Contact pads on the tape are aligned with bonding pads on the IC's. Inyet another embodiment of the multi-conductor insulating assembly,multiple conductors are extruded and cut to form the desiredmulti-conductor assembly which is subsequently adhesively bonded to theIC's with the conductors in contact with the bonding pads on the IC's.

BRIEF DESCRIPTION OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming that which is regarded as the present invention,the advantages of this invention can be more readily ascertained fromthe following description of the invention when read in conjunction withthe accompanying drawings in which:

FIG. 1 is a front view of a stack of IC's on a board;

FIG. 2 is a side view of one of the IC's taken along lines 2—2 of FIG.1;

FIG. 3 is a front view of a stack of IC's according to one embodiment ofthe present invention;

FIG. 4A is a side view of a spool of tape used in connection with FIG.3;

FIG. 4B is a top view of the tape of FIG. 4A;

FIG. 5 is a side view of a portion of FIG. 1;

FIG. 6A is a top view of a multi-conductor port of FIG. 1;

FIG. 6B is a top view of an alternative multi-conductor port;

FIG. 7 is an alternative embodiment to that of FIG. 5;

FIG. 8 is a cross-sectional view taken along line 8—8 of FIG. 7;

FIG. 9 is a front view of an alternative multi-conductor insulatingassembly tape;

FIG. 10 is a front view of four separate conductors connected to fourterminals;

FIG. 11 is a front view of alternative means of connection betweenterminals and a multi-conductor insulating assembly tape;

FIG. 12 is an alternative shape for a terminal;

FIG. 13A is a front view of an alternative embodiment of the presentinvention of a stack of IC's using a conductive epoxy;

FIG. 13B is a side view along line B—B of FIG. 13A of the presentinvention;

FIG. 14A is a front view of yet another embodiment of the presentinvention of a stack of IC's;

FIG. 14B is a bottom view of one of the IC's of FIG. 14A;

FIG. 14C is a top view of one of the multi-conductor insulating assemblytapes of FIG. 14A;

FIG. 15 is a side view of a multi-conductor extrusion prior to cutting amulti-conductor insulating assembly therefrom; and

FIG. 16 is an end view of the multi-conductor extrusion of FIG. 15 priorto cutting a multi-conductor insulating assembly therefrom.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Referring to FIG. 1, an IC device stack assembly 10 includes a stack ofintegrated circuit semiconductor devices 14A, 14B, 14C, and 14D(collectively referred to as IC's 14) positioned on a board 18. IC's 14are illustrated as Thin Small-Outline Package (TSOP) devices, but mayhave another packaging or be unpackaged. IC's 14 may be any of a varietyof devices including, but not limited to, dynamic random access memory(DRAM), static random access memory (SRAM), programmable read onlymemory (PROM), application specific integrated circuits (ASICs), gatearrays, control devices, and microprocessors. Merely as an example, andnot a limitation, the invention may be used with a dual-in-line packagestack on a dual-in-line board. Board 18 may be any of a variety ofboards or supports including, but not limited to, a PCB. Although fourintegrated circuit semiconductor devices are shown in the IC devicestack assembly 10 of IC's, the IC device stack assembly 10 could includea greater or lesser number.

Individual integrated circuit semiconductor devices 14A and 14B may beadhered to each other through adhesive 22A. Accordingly, individualintegrated circuit semiconductor devices 14B and 14C may be adhered toeach other through adhesive 22B. Similarly, integrated circuitsemiconductor devices 14C and 14D may be adhered to each other throughadhesive 22C while integrated circuit semiconductor device 14D may beadhered to board 18 through adhesive 22D. Adhesives 22A, 22B, 22C, and22D (referred to collectively as adhesives 22) may be an adhesivelycoated tape or suitable type liquid adhesive. If desired, adhesive 22Dmay differ from adhesives 22A, 22B, and 22C. Structural members (notshown) other than adhesive may be used to position the IC's 14 withrespect to each other, if desired.

IC's 14 include terminals 30A, 30B, 30C, and 30D (collectively terminals30) and terminals 32A, 32B, 32C, and 32D (collectively terminals 32) tointerface with external electrical components. Terminals 30 and 32 areillustrated as cropped lead fingers, but could have a variety of otherdesired shapes. Multi-conductor ports 36 and 38, described below, aresupported by board 18.

Referring to FIG. 2, a side view of terminals 30A taken along lines 2—2of FIG. 1 is representative of side views of terminals 30B, 30C, 30D,and terminals 32A, 32B, 32C, and 32D. Terminals 30A include terminals30A-1, 30A-2, 30A-3, 30A-4, 30A-5, 30A-6, 30A-7, 30A-8, 30A-9, 30A-10,and 30A-11. Of course, a greater or less number of terminals may beemployed in a particular example. Further, terminals may be applied tomore than two sides of IC's 14. For example, terminals like terminals 30and 32 could be applied to all four sides of each individual IC device14.

To facilitate the interface between IC's 14 and external electricalcomponents, multi-conductor insulating assemblies are connected betweenterminals 30 and multi-conductor port 36 and between terminals 32 andmulti-conductor port 38. The multi-conductor insulating assembliesinclude multi-conductors, as well as insulating material between toseparate conductors. The insulating material may provide a pliable,flexible, yet supportive structure to the conductors. The insulatingmaterial may be any of various materials including, but not limited to,tape and epoxy. The tape may be a polyamide resin in the form of a film(such as is marketed by duPont under the name Kapton™). The tape mayalso be a well known type of heat sensitive shrink type tape. Theconductive materials may be any of a variety of materials includingcopper wire, electrically conductive epoxy, such as EPO-TEK H37-MPsilver filled epoxy, sold by Epoxy Technology, Inc., Billence, Mass.01821-3972, or the like.

Referring to FIG. 3, multi-conductor insulating assembly tape 42includes conductors 50 (FIGS. 4A, B) having conductive sections thatinterface with terminals 30A, 30B, 30C, and 30D, and withmulti-conductor port 36. The nature of these sections depends on thestructure and shape of such terminals, the structure of multi-conductorport 36, and means of keeping multi-conductor insulating assembly tape42 stationary with respect to the individual IC devices 14A-14D andmulti-conductor port 36.

For example, referring to FIGS. 4A and 4B, multi-conductor insulatingassembly tape 42 is referred to as Y-axis tape, because it includesstraight conductors 50 applied to a tape backing 52. Conductors 50 arealigned with a Y-axis with respect to an X-axis board 18.Multi-conductor insulating assembly tape 42 may be wrapped about a spool48. As a portion of multi-conductor insulating assembly 42 is unwoundfrom spool 48, it may be applied to the side of the stacked IC's 14,individually, 14A-14D as shown in FIG. 3. For ease in understanding, aportion of conductors 50 have been labelled 50-1, 50-2, 50-3, 50-4, . .. , and 50-11. Conductors 50 are spaced apart from one another so as toalign with respective ones of terminals 30A, respective ones ofterminals 30B, respective ones of terminals 30C, and respective ones ofterminals 30D.

Tape backing 52 preferably includes a suitable adhesive thereon so as toadhere to the side of IC's 14, individually 14A-14D. For example, asshown in FIG. 3, a portion of backing 52 makes contact with a portion ofeach of the individual IC's 14A-14D at points 56, 58, and 60.

For example, FIG. 5 shows conductors 50-1, 50-2, 50-3, . . . , and 50-11in alignment and making electrical contact with terminals 30A-1, 30A-2,30A-3, . . . , and 30A-11; and in alignment and making electricalcontact with terminals 30B-1, 30B-2, 30B-3, . . . , and 30B-11; inalignment and making electrical contact with terminals 30C-1, 30C-2,30C-3, . . . , and 30C-11; and in alignment and making electricalcontact with terminals 30D-1, 30D-2, 30D-3, . . . , and 30D-11. (Toavoid unnecessary clutter in the drawing figure, not all terminals andconductors are labelled.)

FIG. 6A shows a top view of multi-conductor port 36, which includesconductive sections 66-1, 66-2, 66-3, . . . , and 66-11 spaced to alignwith conductors 50-1, 50-2, 50-3, . . . , and 50-11, respectively.

Multi-conductor insulating assembly tape 44 may be substantially thesame as or differ somewhat from multi-conductor insulating assembly tape42, and terminals 32A, 32B, 32C, and 32D may be substantially the sameas or differ somewhat from terminals 30A, 30B, 30C, and 30D. Further,multi-conductor port 38 may be substantially the same as or differsomewhat from multi-conductor port 36.

Multi-conductor insulating assembly tape 42 may be cut after conductor50-11, or it may just be applied to an adjacent assembly (similar toassembly 10) or wrapped around the back of IC device stack assembly 10and applied to terminals 32A-32D.

In most situations, it is not desirable that every terminal on each ICdevice 14 receive exactly the same electrical signal. Accordingly, it isdesirable that some terminals on IC devices 14A-14D receive differentsignals. Merely as an example, for each of the individual IC's 14A-14D,terminal 30A-11, 30B-11, 30C-11, and 30D-11 could be used as enablingterminals.

Referring to FIG. 7, in such a case, merely as an example,multi-conductor insulating assembly tape 42 could be cut after conductor50-10 and four separate conductors 68-A, 68-B, 68-C, and 68-D could beapplied to terminals 30A-11, 30B-11, 30C-11, and 30D-11, respectively.Merely as an example, separate conductors 68-A, 68-B, 68-C, and 68-Dcould be joined in a tape 70 with an adhesive backing strip 74 thereon(the boarders of which are shown in dashed lines).

Merely as one example, as illustrated in FIG. 8 (which is a side viewtaken along lines 8—8 of FIG. 7), conductor 68D would be immediatelyadjacent to conductor 68C, which would be immediately adjacent toconductor 68B, which would be immediately adjacent to conductor 68A, forthe portion of tape 70 below the respective terminal. There is aninsulating coating of conductors 68B, 68C, and 68D, or other insulationmeans between conductors. (For purposes of illustration, the relativewidths of conductors 68 and tape 70 are exaggerated.)

As another example, as shown in FIG. 9, conductors 68A, 68B, 68C, and68D could traverse different portions of adhesive backing 74 so as notto require overlap. As still another option, conductors 68A, 68B, 68C,and 68D could be completely separate, each having a different backing orbe surrounded by insulators. In the example of FIGS. 8, 9, or 10, theterminals that control chip enable could be on another portion of theIC's 14, such as on the front or back (whereas terminals 30 and 32 areon the side).

In some cases, more than one enable terminal would be required.Enablement could be controlled by addressing signals (e.g. the 2 or 3most significant bits). Further, more than merely enable terminals couldbe different from each individual integrated circuit semiconductordevice, such as IC 14A, as compared to another individual integratedsemiconductor device, such as IC 14B. In such an example, variouspossible multi-conductor insulating assemblies may be used includingthose illustrated in FIGS. 8, 9, and 10. It is possible to have a singlemulti-conductor insulating assembly tape with different levels ofconductors for different terminals. For example, when all correspondingterminals of IC's 14A-14D (e.g., terminals 30A-2, 30B-2, 30C-2, and30D-2) are to receive the same signal, there need be only one level ofconductor. By contrast, if the corresponding terminals of IC's 14A-14D(e.g., terminals 30A-2, 30B-2, 30C-2, and 30D-2) are each to receivedifferent signals, then four levels of conductors may be used. FIG. 10illustrates four separate conductors being used as an alternative tothat of FIG. 9.

FIG. 6B illustrates an alternative multi-conductor port 36 with fourconductive sections 76A, 76B, 76C, and 76D which may be used inconnection with the devices of FIGS. 8, 9, and 10.

Referring to FIG. 11, interface between terminals 30 and conductors 50could be made with a male-female relationship. For example, femalemembers 80 could be connected to conductors 50-1 through 50-11.

Referring to FIG. 12, the terminals may have a variety of shapes. Forexample, by curving terminal 90A-1 (rather than terminal 30A-1), thereis more surface to contact a conductor.

Referring to FIG. 13A, a multi-conductor epoxy assembly 102 and amulti-strand insulating epoxy assembly 104 are used in an IC devicestack assembly 108, which may be the same as IC device stack assembly 10except for replacing multi-conductor insulating tape 42 withmulti-conductor and insulating epoxy assemblies 102 and 104.

Referring to drawing FIG. 13B, multi-conductor epoxy assembly 102includes a plurality of conductors 102′, each formed of suitable wellknown conductive epoxy material. Multi-strand insulating epoxy assembly104 includes a plurality of strips of non-conductive epoxy material 114located between the conductors 102′. Conductors 102′, like conductors 50may be injected into, bombarded on, or otherwise adhered to theinsulating epoxy material 114 forming multi-strand insultating epoxy104. Multiple layers of conductors may also be applied to or intonon-conductive epoxy material 114, such as is the case wherecorresponding terminals (e.g., terminals 30A-2, 30B-2, 30C-2, and 30D-2)are not to receive the same signal. The base epoxy material ofmulti-strand insulating epoxy assembly 104 may be substantially the sameepoxy material as or differ somewhat from the base epoxy material ofmulti-conductor epoxy assembly 102.

Referring to drawing FIG. 14A, a stack 130 of IC's that includes a stackof unpackaged IC's 132A, 132B, and 132C is illustrated. As shown inFIGS. 14A and 14B, the bottom of each of the IC's 132A, 132B, and 132C(of which device 132A is representative) includes bonding pads 134thereon (which are a form of terminals). As shown in FIGS. 14A-14C, thetop of multi-conductor insulating assembly tape 136A, 136B, and 136C (ofwhich tape 136A is representative) includes corresponding contact pads138 connected to conductors 140. Conductors 140 make electrical contactwith a multi-conductor port 142 to interface with other externalcircuitry. As an alternative embodiment of the present invention to theembodiment shown in FIGS. 14A-14C, the bonding pads may be located onthe top of each of the individual IC's. One integratedmulti-conductor/insulating tape assembly may service IC devices on thetop and bottom of the tape.

Referring to drawing FIG. 15, in yet another embodiment of theinvention, as shown in a side view, a plurality of conductors 50-1′,50-2′, 50-3′, 50-4′, 50-5′, etc. may be formed in an extrusion ofsuitable insulating material 160. Any desired number of conductors50-1′, etc. may be formed in the extrusion in any desired matrixconfiguration. The conductors 50-1′, etc. may be any desired shape, suchas square, rectangular, etc. The matrix configuration may be of anydesired shape, such as square, rectangular, etc.

Referring to drawing FIG. 16, the plurality of conductors 50-1′, etc. inthe insulating material 160 as illustrated in drawing FIG. 15 is shownin an end view to illustrate the conductors 50-1′, etc. formed withinthe insulating material 160 to form the desired matrix of conductors.The conductor matrix may be any desired shape having any desired numberof conductors 50-1′, etc. arranged therein. The conductor matrix may becut along either lines A—A or B—B to expose a plurality of conductors50-1′, etc. to form a multi-conductor flexible insulating assembly forconnection to a plurality of IC's 14. The insulation material 160 may beadhesively bonded or secured to portions of the IC's 14, as describedpreviously herein while the conductors 50-1′, etc. may be secured in anysuitable manner to the terminals 30A-1, etc. of the IC's 14, asdescribed herein, to connect the multi-conductor flexible insulatingassembly to the IC's 14. In this manner, the conductors 50-1′, etc. maybe conveniently extruded in a suitable insulation material matrix andcut to the desired number and length to form the desired multi-conductorflexible insulating assembly before connection to the terminals 30A-1,etc. of the IC's 14.

LOC, TAB, and flip-chip arrangements may be used in connection with thevarious embodiments of the present invention.

As used herein, the term “connect” and related words are used in anoperational sense, and are not necessarily limited to a directconnection. For example, terminals 30 are connected to multi-conductorport 36, but indirectly through a conductor of a multi-conductorinsulating assembly tape or epoxy.

Having thus described in detail preferred embodiments of the presentinvention, it is to be understood that the invention defined by theappended claims is not to be limited by particular details set forth inthe above description, as many apparent variations thereof are possiblewithout departing from the spirit or scope thereof.

What is claimed is:
 1. A method of forming a stack of integrated circuitsemiconductor devices, said method comprising the steps of: providing amulti-port connector having a port; providing a board; adhering a firstintegrated circuit semiconductor device having a plurality of terminalsthereon to the board; adhering a second integrated circuit semiconductordevice having a plurality of terminals thereon to the first integratedcircuit semiconductor device; and connecting a multi-conductor flexibleinsulating assembly between at least one of the plurality of terminalson the first integrated circuit semiconductor device to at least one ofthe plurality of terminals of the second integrated circuitsemiconductor device and the port of the multi-conductor port connector.2. The method of claim 1, wherein the multi-conductor flexibleinsulating assembly includes tape.
 3. The method of claim 1, wherein themulti-conductor flexible insulating assembly includes epoxy.
 4. Themethod of claim 1, wherein the multi-conductor flexible insulatingassembly is extruded.
 5. The method of claim 1, wherein themulti-conductor flexible insulating assembly is an extrusion.
 6. Themethod of claim 5, wherein the extrusion is cut to form themulti-conductor flexible insulating assembly.
 7. The method of claim 6,wherein at least one conductor is exposed during the cutting of theextrusion to form the multi-conductor flexible insulating assembly. 8.The method of claim 6, wherein at least two conductors are exposedduring the cutting of the extrusion to form the multi-conductor flexibleinsulating assembly.
 9. The method of claim 1, wherein themulti-conductor flexible insulating assembly includes a plurality ofconductors separated by insulating material.
 10. A method of forming anintegrated circuit semiconductor device assembly, said method comprisingthe steps of: providing a support surface; positioning a firstmulti-conductor insulating assembly on the support surface, the firstmulti-conductor insulating assembly having contact pads; providing afirst integrated circuit semiconductor device having bond pads thereon;providing a second integrated circuit semiconductor device having bondpads thereon; positioning the first integrated circuit semiconductordevice on the first multi-conductor insulating assembly wherein at leastone bond pad of the first integrated circuit semiconductor devicecontacts at least one contact pad of the first multi-conductorinsulating assembly; positioning a second multi-conductor flexibleinsulating assembly on the first integrated circuit semiconductordevice, the second multi-conductor insulating assembly including contactpads; and positioning a second integrated circuit device having at leastone bond pad thereof contacting at least one contact pad of the secondmulti-conductor flexible insulating assembly wherein at least one bondpad of the second integrated circuit semiconductor device contacts atleast one contact pad of the second multi-conductor flexible insulatingassembly.
 11. The method of claim 10, wherein the contact pads of thefirst and second multi-conductor insulating assemblies are connected toconductors which are, in turn, connected to a multi-conductor portsupported by the support surface.
 12. A method of forming an integratedcircuit semiconductor assembly, said method comprising the steps of:providing a board; providing a first integrated circuit semiconductordevice having a plurality of bond pads; providing a firstmulti-conductor insulating assembly having a plurality of contact padsthereon; providing a second integrated circuit semiconductor devicehaving a plurality of bond pads thereon; providing a secondmulti-conductor insulating assembly having a plurality of contact padsthereon; adhering said first integrated circuit semiconductor device tothe board; positioning the first multi-conductor insulating assembly onthe first integrated circuit semiconductor device wherein at least onecontact pad of the plurality of contact pads of the firstmulti-conductor insulating assembly contacts at least one bond pad ofthe plurality of contact pads of the first integrated circuitsemiconductor device; positioning said second integrated circuitsemiconductor device on the first multi-conductor insulating assembly;and positioning a second multi-conductor insulating assembly on thesecond integrated circuit semiconductor device wherein at least onecontact pad of the plurality of contact pads of the secondmulti-conductor insulating assembly contacts at least one bond pad ofthe plurality of contact pads of the second integrated circuitsemiconductor device.
 13. The method of claim 12, wherein the contactpads of the plurality of contact pads of the first and secondmulti-conductor insulating assemblies are connected to conductors whichare, in turn, connected to a multi-conductor port supported by theboard.